10W UV Optowave Laser PCB Separator Machine For Non Contact Depaneling

10W UV Optowave Laser PCB Separator Machine For Non Contact Depaneling

Technical parameters of the project:

1) Laser weight 2000KG

2) main body size (L * w * h) 1680mm * 1650mm * 1800mm

3) Laser power 10W/15W (ultraviolet)

4) scanning speed 1-900mm / MS

5) Cutting width 350mm * 400mm / 350mm * 400mm (double platform)

6) laser power supply AC220V / 3.5kw

7) Accuracy of the whole machine (+20 micron)

8) Cut width 20 +5 um

9) Platform positioning accuracy (+2 um)

10) Platform repetition accuracy (+2 um) material thickness (<1.5 mm) depending on the actual material.

11) Laser Source Ultraviolet Laser


(1) Fully automatic positioning: High-precision CCD is used for automatic positioning and focusing, so that the positioning is fast, accurate and high accuracy, without manual intervention.

(2) Simple operation, realizing the same type of one-key mode, greatly improving production efficiency.

(3) Cutting and directly forming in blocks, layers, designated blocks or selected areas, with neat and smooth cutting edges, no burrs and no glue spills.

(4) Products can be arranged in a matrix for automatic positioning and cutting, especially for fine, difficult, complex patterns and other shapes of cutting.

(V) waste gas treatment system: the air suction system can eliminate all the cutting waste gas, avoiding the harm to operators and environmental pollution.

Laser cutting machine YSV-4A, double platform, greatly improve production efficiency, is specially designed for FPC and PCB processing equipment.

(7) High-performance lasers: Solid-state ultraviolet lasers with international first-line brands have the advantages of good beam quality, small focusing spot, uniform power distribution, small thermal effect, small slit width and high cutting quality, which guarantee the perfect cutting quality.

(8) Efficient and fast FPC/PCB shape cutting, drilling and covering window opening, fingerprint identification chip cutting, TF memory card partition board, mobile camera module cutting and other applications.

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